发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME |
摘要 |
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
|
申请公布号 |
US2010232177(A1) |
申请公布日期 |
2010.09.16 |
申请号 |
US20100788064 |
申请日期 |
2010.05.26 |
申请人 |
PARK JUN SEOK;KANG SEOK HOON |
发明人 |
PARK JUN SEOK;KANG SEOK HOON |
分类号 |
F21V7/22;H01L33/54;H01L33/56;H01L33/58;H01L33/62;H01L33/64 |
主分类号 |
F21V7/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|