发明名称 |
METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA CONDUCTORS |
摘要 |
A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.
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申请公布号 |
US2010229375(A1) |
申请公布日期 |
2010.09.16 |
申请号 |
US20100715551 |
申请日期 |
2010.03.02 |
申请人 |
MUTUAL-PAK TECHNOLOGY CO., LTD. |
发明人 |
HWAN LU-CHEN;CHEN P.C.;MA YU-LIN |
分类号 |
H01P11/00;H05K3/46 |
主分类号 |
H01P11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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