| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent coating operability and sufficiently low stress property, and a highly reliable semiconductor device without generation of exfoliation even in a high temperature reflow treatment and a heat cycle test by using the resin composition as a die attach paste for a semiconductor or as a bonding material for a radiator member. SOLUTION: The resin composition includes (A) a filler, (B) a thermosetting resin, and (C) a polymer or a copolymer of a conjugated diene compound, wherein the acid number of the (co)polymer (C) is 10-150 meqKOH/g. The semiconductor device is produced by using the resin composition. COPYRIGHT: (C)2010,JPO&INPIT |
