| 摘要 |
In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
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