| 摘要 |
There are provided a polypropylene resin composition having a melt flow rate of 5 to 200 g/10 minutes measured at 230° C., and a molded article comprising the same, wherein the polypropylene resin composition does not easily emit a volatile organic compound contained therein, and is superior in its heat stability, light stability and molding processability, and comprises 100 parts by weight of a propylene block copolymer (A), and 0.05 to 5 parts by weight of a hindered amine light stabilizer (B) having (a) a 2,2,6,6-tetramethylpiperidyl group, (b) an acid dissociation constant (pKa) of less than 8, and (c) a rate of decrease in its weight of less than 10% by heating in a nitrogen gas from 25° C. to 300° C. at a temperature increasing rate of 10° C./minute.
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