发明名称 |
METHOD FOR FORMING Cu FILM, AND STORAGE MEDIUM |
摘要 |
<p>A film-forming raw material composed of a Cu complex is supplied to a wafer, which is kept at a relatively high first temperature and has a Ru film as a film-forming base film, and an initial nucleus of Cu is formed on the wafer. Then, the film-forming raw material composed of the Cu complex is supplied to the wafer kept at a relatively low second temperature, and Cu is deposited on the wafer having the initial nucleus of Cu formed thereon.</p> |
申请公布号 |
WO2010103880(A1) |
申请公布日期 |
2010.09.16 |
申请号 |
WO2010JP51592 |
申请日期 |
2010.02.04 |
申请人 |
TOKYO ELECTRON LIMITED;HIWA KENJI;KOJIMA YASUHIKO |
发明人 |
HIWA KENJI;KOJIMA YASUHIKO |
分类号 |
C23C16/18;C23C16/52;H01L21/28;H01L21/285;H01L21/3205;H01L23/52 |
主分类号 |
C23C16/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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