发明名称 METHOD FOR FORMING Cu FILM, AND STORAGE MEDIUM
摘要 <p>A film-forming raw material composed of a Cu complex is supplied to a wafer, which is kept at a relatively high first temperature and has a Ru film as a film-forming base film, and an initial nucleus of Cu is formed on the wafer. Then, the film-forming raw material composed of the Cu complex is supplied to the wafer kept at a relatively low second temperature, and Cu is deposited on the wafer having the initial nucleus of Cu formed thereon.</p>
申请公布号 WO2010103880(A1) 申请公布日期 2010.09.16
申请号 WO2010JP51592 申请日期 2010.02.04
申请人 TOKYO ELECTRON LIMITED;HIWA KENJI;KOJIMA YASUHIKO 发明人 HIWA KENJI;KOJIMA YASUHIKO
分类号 C23C16/18;C23C16/52;H01L21/28;H01L21/285;H01L21/3205;H01L23/52 主分类号 C23C16/18
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