| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To lead out a drain wiring outside a source wiring even without thickening an interlayer insulating film, and to prevent the insulation breakdown of an insulation film such as a LOCOS oxide film and an interlayer insulating film. <P>SOLUTION: A lead frame 50 is disposed on the rear side of a chip. The lead frame 50 and a bonding wire 53 are connected by a drain wiring, which is routed to the chip surface side and connected to a power source wiring 52 formed on the surface side. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
