发明名称 |
DIAMOND WIRE SAW, AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a diamond wire saw which has high performance to hold diamond abrasive grains dispersedly held on an outer surface of a metal core wire without impairing its sharpness during use, and to provide a method of manufacturing the diamond wire saw. SOLUTION: The diamond wire saw has a plated layer 20 covering the outer surface 11 of the metal core wire 10 and dispersedly holds the diamond abrasive grains 30 in the plated layer 20, wherein an entire outer surface of the diamond wire saw, comprising the plated layer 20 and the diamond abrasive grains 30, is covered with a metal thin film 40. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010201542(A) |
申请公布日期 |
2010.09.16 |
申请号 |
JP20090048355 |
申请日期 |
2009.03.02 |
申请人 |
SUMITOMO ELECTRIC IND LTD;SUMITOMO DENKO STEEL WIRE KK |
发明人 |
HOSOE AKIHISA;INASAWA SHINJI;NITTA KOJI;MATSUMOTO TAKESHI;HOSHIMA AKITO |
分类号 |
B24B27/06;B24D3/00;B24D3/06;B24D11/00;H01L21/304 |
主分类号 |
B24B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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