| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy silicone resin which is suitable as an optical encapsulating material that is free from stick at an ordinary temperature, is excellent in hardness, low viscosity, strength, and flexibility, undergoes little curing shrink, has transparency, and is excellent in heat resistance and light fastness, and further is useful for a semiconductor encapsulating material or for uses in electronic parts such as a printed wiring board; and to provide a resin composition containing the resin. SOLUTION: The epoxy silicone resin can be obtained by addition reaction through hydrosilylation between a silicone compound having a Si-H group and an alicyclic compound having a vinyl group and an epoxy group, and has an epoxy equivalent weight of 100-1,000 g/eq., wherein the epoxy silicone resin is represented by formula (1), wherein R<SB>1</SB>is a hydrocarbon group, and A is a group of an alicyclic compound having an epoxy group. COPYRIGHT: (C)2010,JPO&INPIT
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