| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate inspecting method for detecting whether the defect of the substrate is a backside defect produced in the front stage of the inspection process or the backside defect produced during inspection. Ž<P>SOLUTION: The substrate inspection method is configured to inspect the defect formed to the backside of a wafer having a plurality of patterns formed on the surface thereof and defect of the surface other than the backside of the wafer and includes a first backside defect detecting step S201 of detecting the presence and position of the defect in the backside of the wafer, another surface defect detecting steps S202-204 of detecting the presence and position of the defect in the surface other than the backside of the wafer and a second backside defect detecting step S205 of again detecting the presence and position of the defect in the backside of the wafer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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