| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electric characteristics, while exhibiting proper developability and storage stability. <P>SOLUTION: The photosensitive resin composition contains [A] a copolymer containing (a1) a hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components; [B] a novolac resin containing one or more kinds of phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol and 4,4'-dihydroxy-2,2'-diphenylpropane; and [C] a quinonediazide group-containing compound. <P>COPYRIGHT: (C)2010,JPO&INPIT |
