| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for sucking an electronic component holding the electronic component without rocking the electronic component while sufficiently reducing an amount of flux sucked from a suction port. <P>SOLUTION: The apparatus 100 for sucking an electronic component includes a planar contact surface 113a being in contact with an electronic component ED and having an area larger than that of the electronic component. A suction port 116 and a vent 117 are formed in the contact surface. Further, the apparatus for sucking an electronic component includes a sucking device 121 for causing gas to inflow from the suction port. In addition, the apparatus for sucking an electronic component includes an air flow generating device 122 for causing the gas to inflow or outflow from the vent. In the apparatus for sucking an electronic component, the electronic component is sucked to the contact surface by causing the gas to inflow from the suction port by the sucking device. Accordingly, the apparatus can hold the electronic component without rocking the electronic component while sufficiently reducing an amount of flux sucked from the suction port. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
