| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problems wherein, when wiring becomes complicated in accordance with heightening of probe density, vias for a power supply and ground wiring are arranged highly densely, and an interval between adjacent vias becomes narrow, and a space for arranging a signal wire between vias cannot be taken, and extraction of the signal wire to the outside becomes difficult. Ž<P>SOLUTION: A probe card is formed of a multilayer wiring board having wiring inside, a plurality of probes formed by laminating a plurality of plating layers of a conductive metal on the multilayer wiring board, and a plating layer of the conductive metal on the multilayer wiring board, and includes a connection part for connecting electrically each probe in a prescribed state among the plurality of probes. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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