发明名称 BONDING STRUCTURE AND BONDING METHOD FOR LIQUID FLOW CHANNEL, AND INKJET HEAD
摘要 <P>PROBLEM TO BE SOLVED: To enhance protection performance and sealability of a liquid contact face of an adhesive, when bonding a plurality of members arranged highly densely with fine flow channel structure. Ž<P>SOLUTION: This bonding structure for a liquid flow channel formed with the fine flow channel structure by bonding a plurality of substrates includes a liquid-proof film applied part formed by applying a liquid-proof film agent having liquid-proofness against a liquid flowing in a flow channel formed by joining the substrates, to coat the adhesive exposed in a flow channel inside, in a junction part of the substrates, when bonding the plurality of substrates with the adhesive, and a liquid-repellent portion provided in a boundary portion between the liquid-proof film applied part, and a nonapplied part not applied with the liquid-proof film agent, in the flow channel inside, and having liquid repellency against the liquid-proof film agent, and the problem to be solved is solved by providing the bonding structure for the liquid flow channel. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010201715(A) 申请公布日期 2010.09.16
申请号 JP20090048285 申请日期 2009.03.02
申请人 FUJIFILM CORP 发明人 NAGASHIMA KANJI
分类号 B41J2/01;B41J2/16 主分类号 B41J2/01
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