| 摘要 |
<p>Provided is a method for manufacturing a module with a built-in component, in which the risk of occurrence of a short circuit and the like is reduced and no release carrier is required. An interlayer connection conductor hole (3) is formed in a first layer (1) produced from an uncured resin layer, and the hole is filled with an interlayer connection conductor (5) produced from an uncured conductive paste. A circuit component (7) is mounted on the uncured interlayer connection conductor (5) using the tackiness of the interlayer connection conductor, and the first layer (1) and the interlayer connection conductor (5) are cured. After the curing, a second layer (8) produced from an uncured resin layer is formed on the first layer, and thereby the circuit component (7) is embedded in the second layer (8). The component is thus mounted directly on the uncured interlayer connection conductor, so that mounting using solder can be omitted, and the risk of occurrence of solder flash can be eliminated. Moreover, the release carrier becomes unnecessary, thereby achieving a great reduction in the cost of material.</p> |
