| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board which includes a pad with high connection reliability. <P>SOLUTION: The pad 61 is thicker than a semiconductor circuit 58 by 2 to 10 μm. When wire bonding between a terminal 92 of an IC chip 90 and the pad 61 is performed, a connection wire 91 hardly contacts with a solder resist layer 70. This can increase the connection reliability between an electronic component and the pad. The enhanced thickness of the pad 61 increases the metal proportion of the pad. When the proportion of the metal with high stiffness increases, thermal stress can expectedly be reduced, so that the warpage of a substrate can be suppressed. This prevents the deterioration of the connection reliability which is caused by the warpage. <P>COPYRIGHT: (C)2010,JPO&INPIT |
