| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily respond to densification of a wiring pattern. Ž<P>SOLUTION: An electrode pad structure includes a first-layer pad used as a pedestal and a second-layer pad provided on the top side of the first-layer pad and used as a junction layer. The second-layer pad is so provided as to cover the whole top side of the first-layer pad. A method for preparing the electrode pad structure includes at least the process wherein a resist coat of the second layer is so applied as to cover the first-layer pad, the process wherein only the upper part of the first-layer pad is exposed by exposing the resist coat of the second layer to light widely in the area without providing an exposure mask, and the process wherein plating is so applied as to cover the exposed portion of the upper part of the first-layer pad. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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