发明名称 METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE
摘要 <p>Provided are a method for manufacturing an electronic device, wherein generation of warpage is suppressed, and an apparatus for manufacturing an electronic device. The method for manufacturing an electronic device includes a warpage suppressing step wherein the interim product of the electronic device is warped, and a heating step wherein the interim product is heated in the state where the interim product is warped.</p>
申请公布号 WO2010104001(A1) 申请公布日期 2010.09.16
申请号 WO2010JP53614 申请日期 2010.03.05
申请人 NEC CORPORATION;RENESAS ELECTRONICS CORPORATION;MURAI, HIDEYA;IIMORI, KIYOKAZU;MORI, KENTARO;YAMAMICHI, SHINTARO;KAWANO, MASAYA;SOEJIMA, KOUJI 发明人 MURAI, HIDEYA;IIMORI, KIYOKAZU;MORI, KENTARO;YAMAMICHI, SHINTARO;KAWANO, MASAYA;SOEJIMA, KOUJI
分类号 H01L23/12 主分类号 H01L23/12
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