SUBSTRATE CLEANING METHOD

摘要

Provided is a substrate cleaning method by which a substrate having a fine pattern formed thereon is cleaned in a short time without affecting the fine pattern. A wafer (W), on which the fine pattern having a groove or a hole with a representative length of 0.1 µm or less is formed, is disposed in a space containing moisture such that the wafer (W) faces, at a fixed interval, the leading edge portion of a discharge electrode (45), which has the sharp leading edge portion and can be cooled, by having a counter electrode (46) disposed at a predetermined position between the wafer and the leading edge portion. The discharge electrode (45) is cooled so as to form dew on the discharge electrode (45), and a constant voltage is applied to between the discharge electrode (45) and the counter electrode (46). At the time of applying the constant voltage, an aerosol containing fine water particles having a diameter of 10 nm or less is generated at the leading edge portion of the discharge electrode (45), and the wafer (W) is cleaned by spraying the aerosol to the wafer (W).