| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, in which a cured material has flexibility, superior bending resistance and flexibility, and warpage of a board on which the cured material is stacked can be restrained to the utmost. <P>SOLUTION: The photosensitive resin composition contains (B) 0.5-20 pts.wt. of photopolymerization initiator in relation to (A) 100 pts.wt. of polyamide acid resin having radical polymerizable unsaturated bond. The component (A) is a polyamide acid resin containing hydrazide bond having a structural unit expressed by formula (1), which is obtained by interaction of acid anhydride component containing aromatic tetracarboxylic acid anhydride and a diamine component containing at a proportion of 30-100 moles to 100 moles whole diamine components as raw material. In the formula, Ar is a quadrivalent tetracarboxylic acid residue, R<SB>1</SB>is a single-bond or bivalent hydrazide residue, and X<SB>1</SB>, X<SB>2</SB>independently are a hydroxyl radical or a radical polymerizable unsaturated bond radical. <P>COPYRIGHT: (C)2010,JPO&INPIT |
