| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip, such as an MMIC, including an Si-based semiconductor as a substrate, the semiconductor chip having a low-loss transmission line, easily connected to a circuit board for mounting, and securing a stable GND potential. <P>SOLUTION: The semiconductor chip 10 is mounted in a flip-chip manner, and includes an Si substrate 11, an integrated circuit 12 formed on a principal surface of the Si substrate 11, a dielectric film 16 formed over the integrated circuit 12, and a conductor film 17 for grounding formed on an upper surface of the dielectric film 16. The integrated circuit 12 includes a wiring layer 13a having a signal line 15 for transmitting a signal of the integrated circuit 12, and the signal line 15, the dielectric film 16 and a conductor film 17 constitute a microstrip line. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
