| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the deterioration of bonding reliability occurs due to the displacement of a bonding position and the lack of the bonding strength of a flexible wiring substrate and piezoelectric element columns accompanied by the elongation and high density of a head. SOLUTION: A piezoelectric element member 12 constituted by arranging and lining a plurality of piezoelectric element columns 11 in a row are bonded to a base member 4, an FPC 3 is bonded to outer electrodes 25 of the piezoelectric columns 11, first wiring electrodes 31A having first bonding areas 31a whose widths L1 in a piezoelectric element arranging direction bonded to the individual electrodes 25 of the piezoelectric element columns 11 and wiring electrodes 31B having the second bonding areas 31b whose widths L2 in the piezoelectric element arranging direction are wider than the first bonding areas 31a are arranged in the FPC 3, and furthermore, the second wiring electrodes 31B having the second bonding areas 31b are arranged via the first wiring electrodes 31A having the first bonding areas 31a. COPYRIGHT: (C)2010,JPO&INPIT |
