MULTILAYER PRINTED-WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board for improving a reliability of an electrical connection between a first conductive layer and a second conductive layer through a conductive paste, and to provide a method for manufacturing the same. SOLUTION: The multilayer printed-wiring board 1 includes: a first conductive layer 12 provided to a first substrate 11; a second conductive layer 22 provided to a second substrate 21; and a through-hole 2 passing through the second substrate 21 and having a first conductive layer 12 as its bottom. A conductive paste 3 including a planar filler as a conductive filler is filled in the through-hole 2. COPYRIGHT: (C)2010,JPO&INPIT