发明名称 LAMINATE FOR FLEXIBLE SUBSTRATE AND THERMALLY CONDUCTIVE POLYIMIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a laminate for a white thermally conductive flexible substrate and a white thermally conductive polyimide film which are excellent in a heat radiation characteristic, high reflectance and a dimensional change ratio and which have excellent tear resistance even in a thin film form. SOLUTION: A polyimide resin layer constituting the laminate for the flexible substrate or the thermally conductive polyimide film is a layer having a filler-containing polyimide resin layer (i) containing a thermally conductive filler in a range of 20 to 65 wt.% in a polyimide resin containing 50 to 100 mol% of a structural unit deriving from 2,2'-bis (trifluoromethyl)-4,4'-diaminobiphenyl and aromatic tetracarboxylic acid dianhydride. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010201625(A) 申请公布日期 2010.09.16
申请号 JP20090046476 申请日期 2009.02.27
申请人 NIPPON STEEL CHEM CO LTD 发明人 O KOEN;SUDO YOSHIKI
分类号 B32B15/088;B32B15/08;C08G73/10;C08J5/18;C08K3/22;C08K3/28;C08K3/36;C08L79/08 主分类号 B32B15/088
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