发明名称 |
Curable Epoxy Resin Composition and Cured Body Thereof |
摘要 |
A curable epoxy resin composition comprising: (I) an epoxy resin; (II) a curing agent for the epoxy-resin; (III) cross linked silicone particles characterized by having secondary amino groups represented by the following general formula: R1NH—R2— (where R designates an aryl group or an aralkyl group, and R designates a bivalent organic group) and bonded to silicon atoms that form the cross-linked silicone particles {the aforementioned cross-linked silicon particles being used in the amount of 0.1 to 100 parts by weight per 100 parts by weight of the sum of components (I) and (II)}, has excellent flowability in molding and can produce a cured body having low modulus of elasticity.
|
申请公布号 |
US2010234520(A1) |
申请公布日期 |
2010.09.16 |
申请号 |
US20080600142 |
申请日期 |
2008.04.25 |
申请人 |
MORITA YOSHITSUGU;UEKI HIROSHI |
发明人 |
MORITA YOSHITSUGU;UEKI HIROSHI |
分类号 |
C08L63/00 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|