| 摘要 |
<p>The present invention concerns a substrate carrying a delayed-tack formulation, wherein said delayed-tack formulation becomes tacky on heat activation to allow sealing between the substrate and itself or between the substrate and a further material, so that the resultant seal can be pealed open mechanically without damaging or destroying said substrate or said further material, and so that said formulation possesses re-tack properties to allow subsequent resealing.</p> |
