| 摘要 |
<p>A method of producing a heterostructure (200) comprising bonding at least one first substrate (110) having a first thermal expansion coefficient onto a second substrate (120) having a second thermal expansion coefficient, the first thermal expansion coefficient being different from the second thermal expansion coefficient. Prior to bonding, trenches (111) are formed in one of the two substrates from the bonding surface (110a) of the substrate (110). The trenches (111) are filled with a material (130) having a third thermal expansion coefficient lying between the first and second thermal expansion coefficients.</p> |
