| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus manufacturing method, capable of preventing a circuit area from increasing while utilizing the cost advantages of an expensive metallic substrate and configuring a circuit having high operation speed, and to provide an electronic apparatus and an electronic device. <P>SOLUTION: This electronic apparatus manufacturing method includes a first formation process (S1) forming a metallic substrate 11 with a prescribed circuit pattern; a second formation process (S2) forming an insulating layer 12 on the plane of the metallic substrate 11 for planarizing the plane of the metallic substrate 11 formed with the prescribed circuit pattern; and a third formation process (S3) for forming an electronic element 14 developing a prescribed function on the plane of the insulating film 12. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
