| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, provided with a sealing ring having a function as a barrier against moisture infiltration from the cut plane of dicing and against crack extensions by optimizing a seal-ring structure. SOLUTION: The seal ring 100 is disposed between a circuit forming region on a semiconductor substrate 1 and a dicing region. The seal ring 100 includes a part with stacked seal layers, having T-shape cross sections and a part with stacked seal layers having rectangular cross sections. COPYRIGHT: (C)2010,JPO&INPIT
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