发明名称 |
Premolded Substrates with Apertures for Semiconductor Die Packages with Stacked Dice, Said Packages, and Methods of Making the Same |
摘要 |
Disclosed are premolded substrates for semiconductor die packages and methods of making such substrates. An exemplary premolded substrate comprises a leadframe having a first surface, a second surface, a central portion disposed between the first and second surfaces, and a plurality of electrically conductive leads disposed about the central portion; a body of electrically insulating material disposed in a portion of the central portion of the leadframe and between the leads of the leadframe; and an aperture disposed in the leadframe's central portion and between the leadframe's first and second surfaces. |
申请公布号 |
US2010230792(A1) |
申请公布日期 |
2010.09.16 |
申请号 |
US20090403294 |
申请日期 |
2009.03.12 |
申请人 |
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发明人 |
IRVING SCOTT;LIU YONG;LIU YUMIN |
分类号 |
H01L23/495;H01L21/56;H01L25/11 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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