发明名称 |
METHOD FOR FORMING CU FILM AND STORAGE MEDIUM |
摘要 |
A Cu film is deposited on a substrate by placing the substrate within a process chamber, introducing a film-forming material which contains a monovalent copper amidinate and a reducing agent which contains a carboxylic acid into the process chamber in a vapor state, and then reacting the film-forming material and the reducing agent on the substrate. |
申请公布号 |
WO2010103881(A1) |
申请公布日期 |
2010.09.16 |
申请号 |
WO2010JP51610 |
申请日期 |
2010.02.04 |
申请人 |
TOKYO ELECTRON LIMITED;KOJIMA YASUHIKO;HIWA KENJI |
发明人 |
KOJIMA YASUHIKO;HIWA KENJI |
分类号 |
C23C16/18;H01L21/285 |
主分类号 |
C23C16/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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