| 摘要 |
A method of resisting dust and dirt with nanotechnology adapted for electronic products is described hereinafter. Firstly, make an initial reactant into a metal oxide gel of nanometer by way of a sol-gel method. Secondly, dilute the metal oxide gel of nanometer with a diluent to form a coating solution, and then stand the coating solution for a period of time to make the metal oxide gel of nanometer and the diluent well mixed with each other. Next, coat the coating solution onto surfaces of the product evenly to fill up tiny holes on the surfaces of the product. Lastly, put the product coated with the coating solution at the temperature of 20˜22� C. to make the coating solution evaporate so as to form continuous protective films on the surfaces of the product for fully filling up the tiny holes. |
