| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board that prevents a short circuit between microfabricated wiring layers, and to provide a method of manufacturing the same. SOLUTION: The circuit board 10 includes: an insulating substrate 12; a first conductive pattern 14 formed on the upper surface of the insulating substrate 12; a first covering resin 18 formed on the upper surface of the insulating substrate 12 so as to cover the side of the first conductive pattern 14; and a first plated film 24 for converting the upper surface of the first conductive pattern 14 of a region as a pad. With this configuration, a plated film is not formed on the side of the first conductive pattern 14, thereby the adjacent first conductive patterns 14 can be prevented from being short-circuited through the plated film. COPYRIGHT: (C)2010,JPO&INPIT |
