| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an exposed type IC package preventing warpage of a supporting substrate when pressing and having sufficient yield. <P>SOLUTION: The method of manufacturing the IC package 1 includes a first process wherein bare chips 5 each having an optical element 4, are arranged on a principal surface of a printed board 2, and a second process wherein a resin material 10b is applied to the principal surface of the printed board 2 and solidified to cover the principal surface of the printed board 2, and a resin layer having a first opening part is formed at a position corresponding to each optical element 4. The second process contains a pressing process wherein a pressing member 14, having a second opening part 14a at a position corresponding to the first opening part, and a printed board 2 are pressed to each other in a condition where the pressing member 14 is brought into contact with the resin material 10b, to reduce the thickness of the resin material 10b. <P>COPYRIGHT: (C)2010,JPO&INPIT |
