摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a water content or corrosive gas enters through the interface between resin moldings to cause a failure such as peeling, in a light emitting device of a package formed of two kinds of resin moldings. <P>SOLUTION: The light emitting device includes a package having an opening at its upper surface, a first resin molding constituting at least a part of the upper surface of the package, a second resin molding which has light reflectivity higher than that of the first resin molding to constitute at least the inner surface of the opening of the package, and a light emitting element placed in the opening. The device includes a covering member which is provided to be exposed on the package upper surface or in the opening to cover the interface between the first resin molding and the second resin molding. <P>COPYRIGHT: (C)2010,JPO&INPIT |