| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small solid-state imaging device having improved quality by preventing the generation of insulation of wiring patterns owing to tilt or warpage of a solid-state imaging element substrate during production or in a finished product. <P>SOLUTION: The solid-state imaging element substrate is mounted on an insulative structure having a through opening so as to close the through opening, and two kinds of adhesives such as a first adhesive and a second adhesive are formed to fix the solid-state imaging element substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
