| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for molding a resin molding having an embossed pattern of minute unevenness transferred clearly from the cavity of a mold in a molding process. SOLUTION: A molten thermoplastic resin sheet 13 having been extruded from a T die 3 is delivered by a pair of rollers 6 and 6 to be arranged in molds 7 and 8. The cavity of the mold 8 has a transfer surface having the embossed pattern. Next, forms 14 and 15 positioned on the periphery of the molds 7 and 8 are advanced relatively to the molds 7 and 8, and adhered to the extruded thermoplastic resin sheet 13. Vacuum suction is carried out from the cavity surface of the mold 8 while a pressure fluid is introduced into the molds 7 and 8, and thus the resin molding with the embossed pattern transferred on the surface is molded. COPYRIGHT: (C)2010,JPO&INPIT
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