发明名称 |
HEAT TREATMENT APPARATUS OF SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus of a substrate which can promptly heat the whole substrate such as glass substrate to a treatment temperature. SOLUTION: The heat treatment apparatus of the substrate is formed by arranging a heat absorbing fin 14 which absorbs radiant heat between the center of a glass substrate W held by a boat 7 carried in or out of a process tube 4 from a furnace opening 6 of a heat treatment furnace 2 and a heat shield plate 13a which insulates the radiant heat caused by a heater 5 arranged outside the process tube 4. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010205820(A) |
申请公布日期 |
2010.09.16 |
申请号 |
JP20090047893 |
申请日期 |
2009.03.02 |
申请人 |
KOYO THERMO SYSTEM KK |
发明人 |
KASATSUGU KATSUNAO;URASAKI YOSHIHIKO;KUBOTA WATARU;NAKANISHI YUYA |
分类号 |
H01L21/22;C23C16/02;H01L21/205;H01L21/31 |
主分类号 |
H01L21/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|