发明名称 HEAT TREATMENT APPARATUS OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus of a substrate which can promptly heat the whole substrate such as glass substrate to a treatment temperature. SOLUTION: The heat treatment apparatus of the substrate is formed by arranging a heat absorbing fin 14 which absorbs radiant heat between the center of a glass substrate W held by a boat 7 carried in or out of a process tube 4 from a furnace opening 6 of a heat treatment furnace 2 and a heat shield plate 13a which insulates the radiant heat caused by a heater 5 arranged outside the process tube 4. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010205820(A) 申请公布日期 2010.09.16
申请号 JP20090047893 申请日期 2009.03.02
申请人 KOYO THERMO SYSTEM KK 发明人 KASATSUGU KATSUNAO;URASAKI YOSHIHIKO;KUBOTA WATARU;NAKANISHI YUYA
分类号 H01L21/22;C23C16/02;H01L21/205;H01L21/31 主分类号 H01L21/22
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