| 摘要 |
PROBLEM TO BE SOLVED: To reduce degrading in the productivity of a semiconductor device by reliably picking up a semiconductor chip or mounting the chip, even when a collet made of elastic material is used. SOLUTION: By monitoring the amount of air sucked by a suction pump 40 via a suction hole which open to a tip end face 33a of a collet 33, a controller 18 detects contacting of the tip end face 33a of the collet 33 with an object, such as, a semiconductor chip 44 or a lead frame 20, and detects pickup height information and mounting height information for use in controlling the height of the tip end face 33a of the collet 33, upon pickup and mounting, used for current offset of a mounting head 32 from its origin, and then stores the detected information in a memory 19. COPYRIGHT: (C)2010,JPO&INPIT |
