| 摘要 |
<p>The present invention relates to a substrate processing apparatus using a high-pressure processor. The substrate processing apparatus comprises: the high-pressure processor that processes a substrate by using high-pressure carbon dioxide; 1st and 2nd branch lines that respectively carry carbon dioxide from each discharge pipe in order to discharge the carbon dioxide used in the high-pressure processor; a recycling unit which separates an additive from the carbon dioxide supplied through the 1st branch line, condenses the carbon dioxide, and enables a temperature drop resulting from adiabatic expansion of the carbon dioxide in the condensing process, wherein the carbon dioxide is supplied through the 2nd branch line and a cooling pipe that allows coolants of a cooling unit to pass therethrough; a high-pressure pump which pumps the liquid carbon dioxide of the recycling unit or a carbon dioxide supply unit with high pressure; and 1st and 2nd heating buffer units which heat the carbon dioxide boosted through the high-pressure pump in stages, and which function as buffers for supplying the heated carbon dioxide to the high-pressure processor. The present invention configures the recycling unit of a single integrated structure to perform the condensing process after separating the additive from the carbon dioxide used for cleaning. Therefore, equipment volume and footprints can be reduced. In addition, the number of inspection items can be decreased.</p> |
