LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD FOR THE SAME

摘要

PURPOSE: A light emitting diode package and a manufacturing method for the same are provided to improve the heat emission efficiency by using the metal which has high thermal conductivity as the material for the substrate. CONSTITUTION: A substrate(S) comprises a first area(30) and a second area(30'). The substrate comprises an insulating layer(31) interposed between the first area and the second area. The insulating layer insulates the first area and the second area. A light emitting diode chip(35) is mounted on the first area or the second area.