| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to form a penetration electrode without a void by growing a penetration electrode from the bottom of a blind via. CONSTITUTION: A semiconductor chip(10) has an upper side(1), a lower side(2), and a through hole which passes through the upper and lower sides. A seed metal layer(20) is arranged along the inner surface of the semiconductor chip formed by the through hole. An insulation layer(30) is arranged on the seed metal layer and has a hollow. A penetration electrode(40) is filled in the hollow.
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