发明名称 CARRIER FOR DOUBLE SIDE POLISHING APPARATUS AND DOUBLE SIDE POLISHING METHOD USING THE SAME
摘要 PURPOSE: A carrier for a double-side polishing device and a double-side polishing method using the same are provided to improve the flatness of a pad at the same time as polishing both sides of a wafer. CONSTITUTION: A carrier for a double-side polishing device comprises a carrier plate(120) and a dressing block(140). The carrier plate is installed between top and bottom platens(210,230) of a double-side polishing device. The carrier plate is rotated with a sun gear(240) and an internal gear(220) and has a wafer mounting hole and a plurality of discharge holes(124) for discharging polishing fluid. The dressing block is inserted into the discharge holes and polishes pads(212) of upper and lower plates when the carrier plate is rotated.
申请公布号 KR20100099991(A) 申请公布日期 2010.09.15
申请号 KR20090018614 申请日期 2009.03.04
申请人 SILTRON INC. 发明人 LEE, CHI BOK;CHO, HEUI DON;KANG, DAE YEOL;MOON, DO MIN
分类号 B24B7/00;H01L21/304 主分类号 B24B7/00
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