<p>PURPOSE: A method for manufacturing a memory device is provided to prevent the leakage current of a blocking dielectric film by suppressing the interfacial reaction of an silicon oxide in a first dielectric film and an aluminum oxide in a third dielectric film. CONSTITUTION: A tunnel dielectric film(110) is formed on a substrate(10). An electric charge trapping film(120) is formed on the tunnel dielectric film. A blocking dielectric film(130) is formed on the electric charge trapping film. A first dielectric film(131) including a silicon oxide is formed on the electric charge trapping film. A second dielectric film(133) including an aluminum silicate is formed on the first dielectric film. A third dielectric layer(135) including an aluminum oxide is formed on the second dielectric film.</p>
申请公布号
KR20100100550(A)
申请公布日期
2010.09.15
申请号
KR20090025989
申请日期
2009.03.26
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
YOO, DONG CHUL;LEE, EUN HA;LEE, HYUNG IK;HWANG, KI HYUN;HEO, SUNG;CHOI, HAN MEI;KYOUNG, YONG KOO;KIM, BYONG JU