发明名称 FABRICATING METHOD THE MEMORY DEVICE
摘要 <p>PURPOSE: A method for manufacturing a memory device is provided to prevent the leakage current of a blocking dielectric film by suppressing the interfacial reaction of an silicon oxide in a first dielectric film and an aluminum oxide in a third dielectric film. CONSTITUTION: A tunnel dielectric film(110) is formed on a substrate(10). An electric charge trapping film(120) is formed on the tunnel dielectric film. A blocking dielectric film(130) is formed on the electric charge trapping film. A first dielectric film(131) including a silicon oxide is formed on the electric charge trapping film. A second dielectric film(133) including an aluminum silicate is formed on the first dielectric film. A third dielectric layer(135) including an aluminum oxide is formed on the second dielectric film.</p>
申请公布号 KR20100100550(A) 申请公布日期 2010.09.15
申请号 KR20090025989 申请日期 2009.03.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOO, DONG CHUL;LEE, EUN HA;LEE, HYUNG IK;HWANG, KI HYUN;HEO, SUNG;CHOI, HAN MEI;KYOUNG, YONG KOO;KIM, BYONG JU
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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