| 摘要 |
PURPOSE: A stacked semiconductor package is provided to rapidly cool semiconductor chips by forming a cooling space connected with a through hole between semiconductor chips. CONSTITUTION: A substrate(10) comprises a chip area(CR) and a peripheral area(PR). A connection pad(4) is arranged within the chip area of an upper side(1) of the substrate. A ball land(5) is arranged on a bottom(2) facing the top of the substrate. A semiconductor chip module(20) is arranged within the chip area.
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