发明名称 SOLID-STATE IMAGE PICKUP ELEMENT, A METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS USING THE SAME
摘要 PURPOSE: A solid image taking element, a method for manufacturing the same, and an electronic appliance are provided to prevent the short-circuit or the disconnection of a wiring layer due to a gap between a substrate and an end part detection unit by forming a gate electrode on the end part detection unit. CONSTITUTION: Pixel units(13) are composed of a plurality of pixels(12). A scribe line(20) is formed around the pixel units with the pixels. An end part detection unit(21) is formed between two pixel units. The end part detection unit in a square shape is arranged in parallel with the direction of the scribe line. A peripheral circuit unit includes a vertical driving circuit(14), a column signal processing circuit(15), and a horizontal driving circuit(16).
申请公布号 KR20100100624(A) 申请公布日期 2010.09.15
申请号 KR20100017772 申请日期 2010.02.26
申请人 SONY CORPORATION 发明人 ENOMOTO TAKAYUKI;NAKAZAWA KEIICHI
分类号 H01L27/146;H01L21/301;H04N5/335;H04N5/369;H04N5/374 主分类号 H01L27/146
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