PURPOSE: A laminated chip capacitor is provided to remarkably reduce the number of decoupling capacitor used for high MPU(Micro Processor Unit) by reducing PDN(Power Distribution Network) impedance below the target impedance in a frequency area of hundreds kHz. CONSTITUTION: A capacitor main body(110) has a laminating structure in which a plurality of dielectric layers is laminated. The capacitor main body comprises first and second capacitor units. First through fourth external electrodes(131-134) are formed on the external surface of the capacitor main body.
申请公布号
KR20100100722(A)
申请公布日期
2010.09.15
申请号
KR20100074668
申请日期
2010.08.02
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, BYOUNG HWA;WI, SUNG KWON;CHO, HONG YEON;PARK, DONG SEOK;PARK, SANG SOO;PARK, MIN CHEOL