发明名称 MULTILAYER CHIP CAPACITOR
摘要 PURPOSE: A laminated chip capacitor is provided to remarkably reduce the number of decoupling capacitor used for high MPU(Micro Processor Unit) by reducing PDN(Power Distribution Network) impedance below the target impedance in a frequency area of hundreds kHz. CONSTITUTION: A capacitor main body(110) has a laminating structure in which a plurality of dielectric layers is laminated. The capacitor main body comprises first and second capacitor units. First through fourth external electrodes(131-134) are formed on the external surface of the capacitor main body.
申请公布号 KR20100100722(A) 申请公布日期 2010.09.15
申请号 KR20100074668 申请日期 2010.08.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, BYOUNG HWA;WI, SUNG KWON;CHO, HONG YEON;PARK, DONG SEOK;PARK, SANG SOO;PARK, MIN CHEOL
分类号 H01G4/30 主分类号 H01G4/30
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