发明名称 CAMERA MODULE
摘要 PURPOSE: A camera module for reducing the fault of a camera is provided to prevent the overflow of adhesive to the outside of a housing through an adhesive applying opening by fixing the housing and the lens barrel after inserting the adhesive in a point applying type. CONSTITUTION: A camera module includes a substrate(110), a housing(130) and a lens barrel(140). An image sensor(120) is installed to the central part of the substrate. The housing is settled on the top of the substrate. An adhesive applying opening is projected to the top of the housing. The lens barrel is combined to the upper part of the housing. The adhesive is inserted inside an adhesive injection groove of the glue spreading device.
申请公布号 KR20100100063(A) 申请公布日期 2010.09.15
申请号 KR20090018741 申请日期 2009.03.05
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, YONG GU
分类号 H04N5/225 主分类号 H04N5/225
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