| 摘要 |
<P>PROBLEM TO BE SOLVED: To constitute so that static electricity generated in a semiconductor wafer during processing do not accumulate, and to suppress generation of particles caused by the omission of the particles, by making higher mechanical adhesion strength of a conductive layer formed on a placement surface, in a jig for vacuum suction. <P>SOLUTION: The jig for vacuum suction includes a placement constituted by a porous material on which a material for suction is placed, a support portion, in which a recess for holding placement is formed, and a jointing portion to joint the placement to the support portion. A diamond-like carbon film is formed on the surface of the placement with a thickness of 1 to 5 μm. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
