| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively provide a metal ceramic composite capable of being used as a heat dissipation substrate having high bonding strength and high reliability in addition to high heat dissipation property and excellent heat resistance cycle property without causing any crack and dielectric breakdown. <P>SOLUTION: The metal ceramic composite is one where a metal substrate that takes copper or copper alloy as a chief ingredient is bonded to a ceramic substrate 2 via coupling layers 7a, 7b that take copper as a chief ingredient. An average crystal grain size of copper or copper alloy that constitutes the metal substrate is 2 to 100 μm, and average sub grain boundary density is ≤10 mm/mm<SP>2</SP>. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
